| 期刊简称: | IEEE T COMP PACK MAN |
| 期刊全称: | IEEE Transactions on Components Packaging and Manufacturing Technology |
| 影响因子2022: | 2.274 (2023年7月5日更新) |
| 出版商: | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
| 发行地址: | 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141 |
| 索引数据库: | SCIE (Science Citation Index Expanded);
Current Contents Electronics & Telecommunications Collection;
Current Contents Engineering, Computing & Technology;
Essential Science Indicators
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| 影响因子 | SCIE期刊IEEE Transactions on Components Packaging and Manufacturing Technology历年影响因子 派博传思
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影响因子
专业排名 | IEEE Transactions on Components Packaging and Manufacturing Technology影响因子排名@SCIE制造工程
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| 论文收录 | SCIE期刊IEEE Transactions on Components Packaging and Manufacturing Technology历年索引论文数量
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论文收录
专业排名 | IEEE Transactions on Components Packaging and Manufacturing Technology索引论文排名@SCIE制造工程
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历年论文
被引频次 | SCIE期刊IEEE Transactions on Components Packaging and Manufacturing Technology历年被引频次 派博传思
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历年论文
被引频次
专业排名 | IEEE Transactions on Components Packaging and Manufacturing Technology被引频次排名@SCIE制造工程 派博传思
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历年即时
影响因子 | SCIE期刊IEEE Transactions on Components Packaging and Manufacturing Technology历年即时影响因子
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历年即时
影响因子
专业排名 | IEEE Transactions on Components Packaging and Manufacturing Technology即时影响因子排名@SCIE制造工程
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五年总效
影响因子 | SCIE期刊IEEE Transactions on Components Packaging and Manufacturing Technology五年总效影响因子 派博传思
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五年总效
影响因子
专业排名 | IEEE Transactions on Components Packaging and Manufacturing Technology五年总效影响因子排名@SCIE制造工程
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